31.9 C
Delhi
Friday, August 22, 2025

India, US sign MoU for establishing mechanism on semiconductor supply chain

Date:

Share post:

Donate-GC-Razorpay

New Delhi: India and US on Friday signed a Memorandum of Understanding (MoU) for establishing a collaborative mechanism on semiconductor supply chain resiliency and diversitication.

The MoU seeks to establish a collaborative mechanism between the two governments on Semiconductor Supply chain resiliency and diversification in view of US’s CHIPS and Science Act and India’s Semiconductor Mission, an official statement said.

The MoU aims to leverage complementary strengths of both countries and facilitate commercial opportunities and development of semiconductor innovation ecosystems through discussions on various aspects of semiconductor value chain.

It envisages mutually beneficial R&D, talent and skill development, the statement said.

Related articles

Minister says MSMEs are on way to digital transformation

New Delhi: Minister of State for Micro, Small and Medium Enterprises Shobha Karandlaje today told the Lok Sabha...

Parliamentary panel flags US climate fund withdrawal, urges India to lead by example

New Delhi: A parliamentary panel has voiced concern over the United States’ withdrawal from its $100 billion commitment...

Opposition Vice President pick B Sudershan Reddy files nomination

Opposition Vice-Presidential candidate Justice (Retd) B Sudershan Reddy today filed his nomination papers.He filed the nomination in presence...

U.S. imposes sanctions on ICC staffers, drawing criticism from ICC, France

Washington: The U.S. Department of State on Wednesday imposed sanctions on four individuals currently serving on the International...